Surface Mounting Guide
MLC Chip Capacitors
COMMON CAUSES OF
MECHANICAL CRACKING
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are
connected to the PCB. If the board is not supported during
the plug/unplug cycle, it may flex and cause damage to
nearby components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Solder Tip
Preferred Method - No Direct Part Contact
REWORKING OF MLCS
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically
impossible to cause any thermal shock in ceramic
capacitors when using hot air reflow.
However direct contact by the soldering iron tip often
causes thermal cracks that may fail at a later date. If rework
by soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300oC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Solder Tip
Poor Method - Direct Contact with Part
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.
However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is
located.
No Stress Relief for MLCs
Routed Cut Line Relieves Stress on MLC
113
相关PDF资料
AVE477M10G24T-F CAP ALUM 470UF 10V 20% SMD
AVEK337M10G24T-F CAP ALUM 330UF 10V 20% SMD
AVES226M35D16T-F CAP ALUM 22UF 35V 20% SMD
AVEZ476M35X16T-F CAP ALUM 47UF 35V 20% SMD
AVRF107M35F24T-F CAP ALUM 100UF 35V 20% SMD
AVS107M50G24B-F CAP ALUM 100UF 50V 20% SMD
B048F160T24 BCM BUS CONVERTER 16V 240W
B048F320T30 BCM BUS CONVERTER 32V 300W
相关代理商/技术参数
AU016D104KAG2A-5K 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100nF 10% 6.3 Volts Gold Flash RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D104MAG2A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 0.1uF 20% X5R 0201 SIZE RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D223KA72A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 0.01uF 10% X5R 0201 SIZE RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D223KAG2A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 22000pF 10% X5R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU01A 制造商:Sanken Electric Co Ltd 功能描述:Pack 制造商:Sanken Electric Co Ltd 功能描述:Bulk
AU01AV 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL
AU01AV0 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL
AU01AV1 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL